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The Koch Chemie Heavy Cut Buffer Pad uses an abrasive sponge for removing strong weathering and deep scratches. The short height of 23mm creates low torsion forces, very good handling, and the highest level of stability.
The special density of the foam material enables long-lasting compression hardness during polishing. We recommend pairing it with Koch Chemie Heavy Cut H9 01 Coarse Polishing Compound.
The optimized reticulation (open cellular structure) and cell count contribute to a high level of abrasiveness and excellent hygiene factors. The milling edge ensures extra flexibility for the buffing pads, enabling them to fit around contours easier.
The colorful non-woven material, suitable for polishing, ensures process safety.
Compression hardness: 17
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